Reducing I2R losses to enable extended missions
Learn how Vicor delivers high power with efficiency and reduced weight for electronic countermeasures
BCM® Bus Converter Module
Fixed ratio bus converters
Bus Converters are high-density, high-efficiency, fixed ratio (non-regulating) isolated DC-DC converter modules. BCMs are available in ChiP or a Vicor Integrated Adapter (VIA) package which simplifies cooling as well as providing integrated PMBus control, EMI filtering, and transient protection. The family extends from 800V to 48V inputs with various K factors to suit a wide range of applications and markets. Based on our proprietary Sine-Amplitude Converter topology, high voltage BCM ChiPs are able to reach peak efficiencies of 98% and achieve power densities up to 2,400W/in³. These flexible modules can be easily paralleled into high power arrays and outputs can be put in series to achieve a higher VOUT. BCMs are inherently bidirectional and also allow designers to reduce the amount of bulk capacitance needed at the load by effectively ‘reflecting’ the capacitance across the module based on the specified K factor.
MIL-COTS versions are also available and operate from MIL-STD-704E/F 270V and deliver an isolated
Vicor fixed-ratio bus converters are powering many of today’s world changing innovations in electric planes, maritime communication UAVs, and risky underwater ROV explorations.
Power System Designer
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Output
Min output:
Minimum output:
Nom output:
Nominal output:
Max output:
Maximum output:
Features and Benefits
Features and benefits
High efficiency of up to 98%
High power density of up to 2,735W/in3
Parallel capability for higher power arrays
Thermally-adept VIA housing
Resources
Resources for the design engineer
Compact, efficient power solutions enable improved countermeasure capabilities
Explore Vicor's efficient and reduced weight power delivery network for electronic warfare countermeasures systems
Supporting more functionality, increased payload and longer run time
Learn how Vicor delivers high power with efficiency and reduced weight that allows for greater payload options to support mission success
Modular power delivery networks for UAVs
The key challenge we see facing engineers today is the demand for smaller, lighter-weight designs that deliver higher power
- AN:001 – Configuring the Vicor BCM with Low Power niPOLs
- AN:009 – SMT J-Lead VI Chip Soldering Recommendations
- AN:016 – Using BCM™ Bus Converters in High Power Arrays
- AN:017 – RoHS Compliant Through-Hole VI Chip Soldering Recommendations
- AN:031 – Through-Hole ChiP Package Soldering Guidelines
- AN:034 – Creating Higher Voltage Outputs using Series Connected Sine Amplitude Converters
- AN:036 – Recommendations for Maximum Compressive Force of Heat Sinks
- AN:038 – HV ChiP BCM® Reverse Start Up Circuit
- AN:039 – Thermal Management for VIA and ChiP Modules
- AN:401 – PCB Mount VIA Soldering Guidelines
- UG:010 – VI Chip High Voltage BCM Evaluation Board User Guide
- UG:015 – Analog Low Voltage/High Voltage 6123 ChiP BCM Bus Converter Evaluation Board User Guide
- UG:018 – PMBus 2361 and 6123 ChiP BCM Bus Converter Evaluation Board User Guide
- Graphic user interface (GUI) to access PMBus(TM) interface
- UG:901 – PMBus Interface and Accessories User Guide (Current)
- Instrumentation for ore prospecting allows reliable operation in a tough environment
- DC-DC transformer facilitates implementation of longer underwater tether
- High density power allows for unobtrusive, 5G indoor small-cell base station
- Additional electronics for passenger seat actuators are solved with smaller, lighter components
- Enormous video wall display becomes feasible with a move to component-enabled, higher voltage bus
- 5kW tethered UAVs fly higher and longer using increased voltage on the tether
- Bidirectional DC-DC converters conveniently transfer power between the grid and batteries in home energy storage
- High voltage bus converters significantly reduce installation costs for outdoor stadium lighting
- High power supply efficiency provides reliable power over ethernet
- Scalable, low-weight DC-DC solution for high-capacitive loads in airborne radar
- cURus – UL 60950-1, CSA 60950-1
- cTÜVus – EN 62368-1, UL 62368-1, CSA 62368-1
- CE Mark – Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate – IEC 62368-1
- cURus – UL 60950-1, CSA 60950-1
- cTÜVus – EN 60950-1, UL 60950-1, CSA 60950-1
- CE Mark – Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate – IEC 60950-1
- cURus – UL 60950-1, CSA 60950-1
- cTÜVus – EN 60950-1, UL 60950-1, CSA 60950-1
- CE Mark – Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate – IEC 60950-1
- cURus – UL 60950-1, CSA 60950-1
- cTÜVus – EN 62368-1, UL 62368-1, CSA 62368-1
- CE Mark – Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate – IEC 62368-1
- UKCA Declaration of Conformity
- cURus – UL 60950-1, CSA 60950-1
- cTÜVus – EN 62368-1, UL 62368-1, CSA 62368-1
- CE Mark – Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate – IEC 62368-1
- cURus – UL 60950-1, CSA 60950-1
- cTÜVus – EN 62368-1, UL 62368-1, CSA 62368-1
- CE Mark – Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate – IEC 62368-1
- cTÜVus – EN 62368-1, UL 62368-1, CSA 62368-1
- CE Mark – Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate – IEC 62368-1
For California residents see information regarding California Proposition 65
- Full Chip J-lead Product Outline Drawing
PDF DXF - Full Chip Through-Hole Product Outline Drawing
PDF DXF - 6123 ChiP Through-Hole Product Outline Drawing
PDF DXF - 6123 ChiP High Current Package (Pins on the long side)Through-Hole Product Outline Drawing
PDF DXF - 3814 VIA Package Chassis Mount Outline Drawing
PDF DXF - 3814 VIA Package Board Mount Outline Drawing
PDF DXF - 4414 VIA Package Chassis Mount Outline Drawing
PDF DXF - 4414 VIA Package Board Mount Outline Drawing
PDF DXF
- Full Chip J-lead Product 3-D Model Drawing
IGS STP - Full Chip Through-Hole 3-D Model Drawing
IGS STP - 6123 ChiP Through-Hole Product 3-D Model Drawing
IGS STP - 6123 ChiP High Current (Pins on the long side)Through-Hole Product 3-D Model Drawing
IGS STP - 3814 VIA Chassis Mount 3-D Model Drawing
IGS STP - 3814 VIA Board Mount Short Pin 3-D Model Drawing
IGS STP - 3814 VIA Board Mount Long Pin 3-D Model Drawing
IGS STP - 4414 VIA Chassis Mount 3-D Model Drawing
IGS STP - 4414 VIA Board Mount Short Pins with communication 3-D Model Drawing
IGS STP - 4414 VIA Board Mount Long Pins with communication 3-D Model Drawing
IGS STP - 4414 VIA Chassis Mount High Voltage 3-D Model Drawing
IGS STP - 4414 VIA Board Mount Short Pins High Voltage 3-D Model Drawing
IGS STP - 4414 VIA Board Mount Long Pins High Voltage 3-D Model Drawing
IGS STP - 4414 VIA Chassis Mount High Current 3-D Model Drawing
IGS STP - 4414 VIA Board Mount Short Pins High Current 3-D Model Drawing
IGS STP - 4414 VIA Board Mount Long Pins High Current 3-D Model Drawing
IGS STP - 4414 VIA Chassis Mount Ultra High Voltage 3-D Model Drawing
IGS STP - 4414 VIA Board Mount Short Pins Ultra High Voltage 3-D Model Drawing
IGS STP - 4414 VIA Board Mount Long Pins Ultra High Voltage 3-D Model Drawing
IGS STP
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