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Packaging used in product shipping

Products shipping in a clamshell

  • VI-2 
  • VI-J 
  • Full Brick (Maxi) 
  • Half Brick (Mini) 
  • Quarter Brick (Micro) 
  • Double Brick Package (ACFE) 
  • 1714 VIA (AIM)(TPM) 
  • 3414 VIA
  • 3714 VIA 
  • 3814 VIA (BCM) 
  • 4414 VIA 
  • 4914 VIA 
  • 5614 VIA 

Products shipping in JEDEC trays 

  • Full Chip 
  • Half Chip 
  • 10 x 10 LGA SiP (Data Center PRM) 
  • 10 x 14 LGA SiP (Data Center PRM) 
  • 10.5 x 14.5 LGA SiP (MIL Buck) 
  • 0823 ChiP 
  • 1323 ChiP (Data Center VTM) 
  • 1714 ChiP (MFM) 
  • 2322 ChiP (Data Center VTM) 
  • 3314 ChiP (MFM) 
  • 3623 ChiP 
  • 4623 ChiP 
  • 6123 ChiP