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MIL-COTS MI-MegaMod™ DC-DC converters
MI-MegaMods offer up to a total of 300W from one, two or three outputs. Each unit incorporates one, two or three component-level Vicor MI-200/MI-J00 DC-DC converters in a chassis-mount package. In addition, the MI-MegaMod chassis-mount packaging can also be used on the MI-IAM, MI-RAM and MI-AIM modules.
Standard features such as wide output trimming/programming, current limiting, remote sense and logic enable/disable combine to offer a high degree of protection, versatility and reliability for power systems.
Power System Designer
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Output
Min output:
Minimum output:
Nom output:
Nominal output:
Max output:
Maximum output:
Features and Benefits
Features and Benefits
One, two or three outputs
MIL‑STD‑704D/E/F transient compliance for 28 and 270VDC
MIL‑STD‑1399A compliance for 155VDC
Resources
Resources for the design engineer
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Providing kilowatts of power for auxiliary systems to a fuel-cell eVTOL aircraft
Vicor high-density power modules effectively manage kilowatts of power and reduce the energy needed for flight
Advanced power module packaging optimizes available power, reliability and safety in autonomous electric shuttles
Vicor high-efficiency power modules ensure minimal heat dissipation, reducing the need for complex cooling solutions and maximizing power
- VI-200, VI-J00 Design Guide and Applications Manual
- VI-200, VI-J00 Design Guide and Applications Manual
- 1. Zero-Current Switching
- 1. Zero-Current Switching
- 2. DC-DC Converter Pinouts
- 3. Module Dos and Donts
- 4. Overcurrent Protection
- 5. Output Voltage Trimming
- 6. Multiple Gate In Connections
- 7. Applications Circuits / Converter Array Design Considerations
- 8. Using Boosters and Parallel Arrays
- 9. EMC Considerations
- 10. Optional Output Filters
- 11. Battery Charger (BatMod)
- 12. AC Input Module (AIM / MI-AIM)
- 12. AC Input Module (AIM / MI-AIM)
- 13. Harmonic Attenuator Module (HAM)
- 14. Input Attenuator Module (IAM / MI-IAM)
- 15. Ripple Attenuator Module (RAM / MI-RAM)
- 16. Offline Front End
- 17. DC Input Power System (ComPAC / MI-ComPAC Family)
- 17. DC Input Power System (ComPAC / MI-ComPAC Family)
- 18. AC Input Power System (FlatPAC Family)
- 19. AC Input Power System (PFC FlatPAC)
- 20. Thermal and Module Mounting Considerations
- 20. Thermal and Module Mounting Considerations
- 21. Thermal Curves
- 22. Lead Free Pins (RoHS)
- 23. Tin Lead Pins
- 24. Module Packaging Options (SlimMod, FinMod, BusMod and MegaMod Families)
- 25. Product Weights
- 26. Glossary of Technical Terms
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