Powering AI processors – 48V vertical power delivery changes the game
AI models demand huge current, driving legacy multiphase designs past 50 phases—causing space, thermal, and control limits Vicor addresses
VTM™ current multiplier
Factorized power current multiplier
The VTM is a family of fixed ratio, isolated or non-isolated DC-DC transformer modules — also referred to as Point-of-Load (PoL) current multipliers. VTMs operate from a regulated primary bus to deliver a wide range of isolated outputs. A proprietary multi-megahertz ZCS/ZVS Sine Amplitude Converter™ (SAC™) topology transforms input voltages down to fractional voltages very efficiently for applications with demanding load and high-density requirements.
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| Part Number | Datasheet | Vin (V) | Vout (V) | Output Current (A) | K Factor | Mounting | Temperature | Dimensions mm | Dimensions in. | Package | Add to cart / view details | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Part Number: | Vin (V): 40 (26 - 55) |
Vout (V): 1.0 (0.7 - 1.4) |
Output Current (A): 130.0 |
K Factor: 1/40 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 4.0 (2.2 - 4.6) |
Output Current (A): 50.0 |
K Factor: 1/12 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 4.0 (2.2 - 4.6) |
Output Current (A): 50.0 |
K Factor: 1/12 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 6.0 (3.3 - 6.9) |
Output Current (A): 40.0 |
K Factor: 1/8 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 6.0 (3.3 - 6.9) |
Output Current (A): 46.0 |
K Factor: 1/8 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 8.0 (4.3 - 9.2) |
Output Current (A): 30.0 |
K Factor: 1/6 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 9.6 (5.2 - 11.0) |
Output Current (A): 25.0 |
K Factor: 1/5 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 12.0 (6.5 - 13.8) |
Output Current (A): 25.0 |
K Factor: 1/4 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 12.0 (6.5 - 13.8) |
Output Current (A): 25.0 |
K Factor: 1/4 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 16.0 (8.7 - 18.3) |
Output Current (A): 15.0 |
K Factor: 1/3 |
Mounting: J-Lead |
Temperature: -55 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 16.0 (8.7 - 18.3) |
Output Current (A): 15.0 |
K Factor: 1/3 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 24.0 (13.0 - 27.5) |
Output Current (A): 12.5 |
K Factor: 1/2 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 32.0 (17.3 - 36.7) |
Output Current (A): 9.4 |
K Factor: 2/3 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 48.0 (26.0 - 55.0) |
Output Current (A): 6.3 |
K Factor: 1 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 42 (26 - 55) |
Vout (V): 3.5 (2.2 - 4.6) |
Output Current (A): 25.0 |
K Factor: 1/12 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 22.0 x 16.5 x 6.73mm |
Dimensions in.: 0.65 x 0.866 x 0.249in |
Package: Half Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 6.0 (3.3 - 6.9) |
Output Current (A): 20.0 |
K Factor: 1/8 |
Mounting: J-Lead |
Temperature: -55 to +125°C |
Dimensions mm: 22.0 x 16.5 x 6.73mm |
Dimensions in.: 0.65 x 0.866 x 0.249in |
Package: Half Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 6.0 (3.2 - 6.9) |
Output Current (A): 20.0 |
K Factor: 1/8 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 22.0 x 16.5 x 6.73mm |
Dimensions in.: 0.65 x 0.866 x 0.249in |
Package: Half Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 12.0 (6.5 - 13.8) |
Output Current (A): 10.0 |
K Factor: 1/4 |
Mounting: J-Lead |
Temperature: -55 to +125°C |
Dimensions mm: 22.0 x 16.5 x 6.73mm |
Dimensions in.: 0.65 x 0.866 x 0.249in |
Package: Half Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 12.0 (6.5 - 13.8) |
Output Current (A): 10.0 |
K Factor: 1/4 |
Mounting: J-Lead |
Temperature: -40 to +125°C |
Dimensions mm: 22.0 x 16.5 x 6.73mm |
Dimensions in.: 0.65 x 0.866 x 0.249in |
Package: Half Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 4.0 (2.2 - 4.6) |
Output Current (A): 50.0 |
K Factor: 1/12 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 4.0 (2.2 - 4.6) |
Output Current (A): 50.0 |
K Factor: 1/12 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 6.0 (3.3 - 6.9) |
Output Current (A): 40.0 |
K Factor: 1/8 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 8.0 (4.3 - 9.2) |
Output Current (A): 30.0 |
K Factor: 1/6 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 9.6 (5.2 - 11.0) |
Output Current (A): 25.0 |
K Factor: 1/5 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 12.0 (6.5 - 13.8) |
Output Current (A): 25.0 |
K Factor: 1/4 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 12.0 (6.5 - 13.8) |
Output Current (A): 25.0 |
K Factor: 1/4 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 16.0 (8.7 - 18.3) |
Output Current (A): 15.0 |
K Factor: 1/3 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 24.0 (13.0 - 27.5) |
Output Current (A): 12.5 |
K Factor: 1/2 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 32.0 (17.3 - 36.7) |
Output Current (A): 9.4 |
K Factor: 2/3 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 48 (26 - 55) |
Vout (V): 48.0 (26.0 - 55.0) |
Output Current (A): 6.25 |
K Factor: 1 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 32.5 x 22.0 x 6.73mm |
Dimensions in.: 1.28 x 0.866 x 0.249in |
Package: Full Chip |
View Details | ||
| Part Number: | Vin (V): 40 (0 - 60) |
Vout (V): 5.0 (0 - 7.5) |
Output Current (A): 25.0 |
K Factor: 1/8 |
Mounting: Surface Mount |
Temperature: -40 to +125°C |
Dimensions mm: 22.83 x 8.52 x 4.90mm |
Dimensions in.: 0.89 x 0.335 x 0.193in |
Package: 2308 |
View Details | ||
| Part Number: | Vin (V): 48 (0 - 60) |
Vout (V): 12.0 (0 - 15) |
Output Current (A): 12.5 |
K Factor: 1/4 |
Mounting: Surface Mount |
Temperature: -40 to +125°C |
Dimensions mm: 22.83 x 8.52 x 4.90mm |
Dimensions in.: 0.89 x 0.335 x 0.193in |
Package: 2308 |
View Details | ||
Power System Designer
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Output
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Max output:
Maximum output:
Features and Benefits
Features and benefits
High density
Wide VIN optimized for 48VOUT
High efficiency
Flexible
Resources
Resources for the design engineer
Innovative 48V AI power architecture delivers both high current density and high current gain
Vicor 48V Factorized Power Architecture slashes thermal losses and delivers high current density to meet the extreme power demands of AI processors
48V Factorized Power Architecture™ slashes thermal losses and outperforms multiphase approach when powering AI
AI hardware faces severe power and cooling limits. Engineers debate 48V vs. 6V intermediate buses alongside new vertical power delivery (VPD) structures
Betterfrost: Putting on the heat
Betterfrost uses a 48V module for pulsed, conductive glass heating, clearing ice in under 80 seconds while cutting start-up defrost energy by 95%
- AN:005 – FPA Printed Circuit Board Layout Guidelines
- AN:009 – SMT J-Lead VI Chip Soldering Recommendations
- AN:017 – RoHS Compliant Through-Hole VI Chip Soldering Recommendations
- AN:031 – Through-Hole ChiP Package Soldering Guidelines
- AN:034 – Creating Higher Voltage Outputs using Series Connected Sine Amplitude Converters
- AN:036 – Recommendations for Maximum Compressive Force of Heat Sinks
- cURus – UL 60950-1, CSA 60950-1
- cTÜVus – EN 60950-1, UL 60950-1, CSA 60950-1
- CE Mark – Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate – IEC 60950-1
- cURus – UL 60950-1, CSA 60950-1
- cTÜVus – EN 60950-1, UL 60950-1, CSA 60950-1
- CE Mark – Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate – IEC 60950-1
- cURus – UL 60950-1, CSA 60950-1
- cTÜVus – EN 60950-1, UL 60950-1, CSA 60950-1
- CE Mark – Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate – IEC 60950-1
- cURus – UL 62368-1, CSA 62368-1
- cTÜVus – EN 60950-1, UL 60950-1, CSA 60950-1
- CE Mark – Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate – IEC 60950-1
For California residents see information regarding California Proposition 65
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