Building a smarter ultra-wide DC-DC converter solution with multiple parts
One-size-fits-all typically simplifies situations. However, this approach does not deliver the best results when selecting an ultra-wide DC-DC power supply
MI-ComPAC™ DC power supply
The
Power System Designer
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Output
Min output:
Minimum output:
Nom output:
Nominal output:
Max output:
Maximum output:
Features and Benefits
Features and Benefits
One, two or three outputs
MIL‑STD-461C/D/E
MIL‑STD‑704A‑F, 1275A/B/D and DO‑160E compliance for transients
Resources
Resources for the design engineer
Attributes of high‑performance power module packaging
Power module packaging, has been a unique differentiator for Vicor since its inception
Innovating power delivery networks
Every electronic piece of equipment or system has a power delivery network (PDN)
Build small, lighter power systems by eliminating bulk capacitance
Powering systems that are eight to ten times smaller and lighter than conventional solutions
- VI-200, VI-J00 Design Guide and Applications Manual
- VI-200, VI-J00 Design Guide and Applications Manual
- 1. Zero-Current Switching
- 1. Zero-Current Switching
- 2. DC-DC Converter Pinouts
- 3. Module Dos and Donts
- 4. Overcurrent Protection
- 5. Output Voltage Trimming
- 6. Multiple Gate In Connections
- 7. Applications Circuits / Converter Array Design Considerations
- 8. Using Boosters and Parallel Arrays
- 9. EMC Considerations
- 10. Optional Output Filters
- 11. Battery Charger (BatMod)
- 12. AC Input Module (AIM / MI-AIM)
- 12. AC Input Module (AIM / MI-AIM)
- 13. Harmonic Attenuator Module (HAM)
- 14. Input Attenuator Module (IAM / MI-IAM)
- 15. Ripple Attenuator Module (RAM / MI-RAM)
- 16. Offline Front End
- 17. DC Input Power System (ComPAC / MI-ComPAC Family)
- 17. DC Input Power System (ComPAC / MI-ComPAC Family)
- 18. AC Input Power System (FlatPAC Family)
- 19. AC Input Power System (PFC FlatPAC)
- 20. Thermal and Module Mounting Considerations
- 20. Thermal and Module Mounting Considerations
- 21. Thermal Curves
- 22. Lead Free Pins (RoHS)
- 23. Tin Lead Pins
- 24. Module Packaging Options (SlimMod, FinMod, BusMod and MegaMod Families)
- 25. Product Weights
- 26. Glossary of Technical Terms
- Outline Drawing for ComPAC, "L" Configuration (Single)
PDF DXF - Outline Drawing for ComPAC, "M" Configuration (Dual)
PDF DXF - Outline Drawing for ComPAC, "N" Configuration (Triple)
PDF - Outliine Drawing for ComPAC, "N" Configuration (Triple)
DXF - Outline Drawing for ComPAC, "P" Configuration (Dual)
PDF DXF - Outline Drawing for ComPAC, "Q" Configuration (Triple)
PDF DXF - Outline Drawing for ComPAC, "R" Configuration (Triple)
PDF DXF - Outline Drawing for ComPAC, "L" Configuration (Single) -CC*
PDF - Outline Drawing for ComPAC, "L" Configuration (Single) -CC*
DXF - Outline Drawing for ComPAC, "P" Configuration (Dual) -CC*
PDF DXF - Outline Drawing for ComPAC, "M" Configuration (Dual) -CC*
PDF DXF - Outline Drawing for ComPAC, "Q" Configuration (Triple) -CC*
PDF - Outline Drawing for ComPAC, "Q" Configuration (Triple) -CC* »
DXF - Outline Drawing for ComPAC, "R" Configuration (Triple) -CC*
PDF DXF - Outline Drawing for ComPAC, "N" Configuration (Triple) -CC*
PDF DXF
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A highly flexible system of DC input; power building blocks that can be configured for up to 4 outputs